We at Anuva provide custom Schematic design, Layout and printed circuit board design of customer designs, PCB layout and routing for power, analog, digital, and mixed-signal boards. We can provide you with ready to fab Gerbers or we can deliver fabricated PCBs as per requirements.( Please refer our capabilities under PCB Fabrication)
We undertake full cycle of PCB design – Schematic capture, Placement, Routing, testability analysis, etc. Our engineers are well versed in
- High Layer Count PCB
- Blind, Buried, and Micro Via
- Mixed-Signal Design
- High-Power Circuit Design
- High-Speed Design
- Micro-BGA and BGA
- Single Ended and Differential Controlled Impedance lines
- Matched Trace Length
- EMI/EMC Compliance (MIL Specs where required)
PCB Fabrication
We have partners with state of the art manufacturing facilities in USA, Taiwan, South Korea, Israel, Hong Kong who have been working with us for more than 15 years.
- Rigid PCB
- Rigid-Flex PCB
- Flex PCB
| Details | Capability | |
| Max PCB Layers | 64 | |
| Max Board Size | 43inches X 26inches | |
| Max. Board Thickness | 394mil | |
| Min. Board Thickness | 12mil | |
| Min. Core Thickness | 2mil | |
| Max. Final Copper Thickness | Inner Layer | 12oz |
| Outer Layer | 12oz | |
| Min. Line Width/Scace | 2.5mil/2.5mil | |
| Min. CNC Drilling Size | 4mil | |
| Min. Laser Drilling Size | 3mil | |
| Min. PAD. Size | Inner Layer | 5.5mil |
| Outer Layer | 6mil | |
| Details | Unit | Production | Prototype |
| Min line Width/Space | um | 40/40 | 40/40 |
| Max laver count | 30 | 30 | |
| Min. Board Thickness | mm | 0.1 | 0.1 |
| Min. CCL Thickness | um | 40 | 40 |
| Min. Build-Up Thickness | um | 40 | 40 |
| Max Micro-via / Land PAD Design | um | 400/600 | 400/600 |
| Max Micro-via / Land PAD Design | um | 75/225 | 75/225 |
| Max Aspect Ratio | um | 1:1 | 1:1 |
| Details | Capability | Remarks | |
| Material | Flex | Adhesiveless FCCL | – |
| Rigid | Mid to High Tg, LF, HFPL High Frequency | – | |
| Low Flow | Epoxy Adhesive Series Acrylic adhesive series | – | |
| Cover Layer | Epoxy Adhesive Series Acrylic adhesive series | – | |
| Layers | Max | 10R+16F+10R | F- Flex
R-Rigid |
| Min | 1R+1F | ||
| Thickness | Thickness | Min 0.4mm | – |
| Tolerance | Min +/- 0.05mm | – | |
| Copper Thickness | Inner Layer | ½-2Oz | Base copper |
| Outer Layer | ½ Oz – 2Oz | – |
| Details | Capability | Remarks | |
| Material | FCCL | Adhesiveless FCCL | – |
| Stiffener | Mid to High Tg, LF, HFPL High Frequency | – | |
| Adhesive Sheet | Epoxy Adhesive Series Acrylic adhesive series | – | |
| Cover layer | Epoxy Adhesive Series Acrylic adhesive series | Mainly Acrylic Adhesive series | |
| Layers | FPC | 10 | – |
| Finished Thickness | Thickness | Min 0.5mm | Single Sided FPC |
| Tolerance | Min +/- 0.03mm | ||
| Copper Thickness | Inner Layer | 1/3 -1 Oz | Base copper |
| Outer Layer | 1/3 Oz – 2Oz | Base Copper | |
| Finished Size | Min | 5mm x 5 mm | |
| Max | 500mm x 1000mm | ||
| Min Line Width / Space | Inner Layer | 2 mil / 2mil | Finished Copper Hoz |
| Outer Layer | 2 mil/ 2 mil | Finished Copper 1oz | |
| Finished Drilling | CNC Drill | Min Φ 0.15mm | |
| Laser Drill | Min Φ 0.05mm | CO2 Laser Drill | |
| Aspect Ratio | CNC Drill | Max 1.2:1 | Φ 0.1mm Blind Via |
| Laser Drill | Max 18:1 | Φ 0.3 mm | |
| Dielectric Thickness | FCCL | Min 0.0125mm | |
| Routing Tolerance | Laser Routing | +/- 0.005mm | UV Laser Cutting |
| Punching | Min 0.05mm | Walking Wire Steel Mould | |
| Surface Finish | ENIG, Gold Flash, HASL/HASL Lead Free, OSP, Immersion Tin, EPENIG, Immersion Silver, Plating Sn-Cu |